Semiconductor memory device

ABSTRACT

According to one embodiment, a semiconductor memory device includes: a first interconnect layer including a first electrode that extends in a first direction and a second electrode that extends in a second direction and is in contact with one end of the first electrode; a second interconnect layer including a third electrode that is provided adjacently to the first electrode and a fourth electrode that is in contact with one end of the third electrode; a first semiconductor layer provided between the first electrode and the third electrode; a first charge storage layer provided between the first semiconductor layer and the first electrode; a second charge storage layer provided between the first semiconductor layer and the third electrode; and a first bit line provided above the first semiconductor layer and extending in the first direction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No.62/712,573, filed Jul. 31, 2018, the entire contents of which areincorporated herein by reference.

FIELD

Embodiments described herein relate generally to a semiconductor memorydevice.

BACKGROUND

A NAND flash memory is known as a semiconductor memory device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a semiconductor memory device according toa first embodiment.

FIG. 2 is a circuit diagram of a memory cell array included in thesemiconductor memory device according to the first embodiment.

FIG. 3 is a plan view of the memory cell array included in thesemiconductor memory device according to the first embodiment.

FIG. 4 is a plan view of a region RA shown in FIG. 3.

FIG. 5 is a sectional view of the memory cell array, taken along lineA1-A2 shown in FIG. 3.

FIG. 6 is a sectional view of the memory cell array, taken along lineB1-B2 shown in FIG. 3.

FIGS. 7-15 are diagrams showing a process of manufacturing thesemiconductor memory device according to the first embodiment.

FIG. 16 is a circuit diagram of a memory cell array included in asemiconductor memory device according to a second embodiment.

FIG. 17 is a plan view of the memory cell array included in thesemiconductor memory device according to the second embodiment.

FIG. 18 is a sectional view of the memory cell array, taken along lineA1-A2 shown in FIG. 17.

FIG. 19 is a sectional view of the memory cell array, taken along lineB1-B2 shown in FIG. 17.

FIGS. 20-25 are diagrams showing a process of manufacturing thesemiconductor memory device according to the second embodiment.

FIG. 26 is a plan view of a memory cell array included in asemiconductor memory device according to a third embodiment.

FIG. 27 is a sectional view of the memory cell array, taken along lineA1-A2 shown in FIG. 26.

FIG. 28 is a sectional view of the memory cell array, taken along lineC1-C2 shown in FIG. 26.

FIGS. 29-33 are diagrams showing a process of manufacturing thesemiconductor memory device according to the third embodiment.

FIG. 34 is a sectional view of a memory cell array included in asemiconductor memory device according to a fourth embodiment, takenalong line A1-A2.

FIG. 35 is a sectional view of the memory cell array included in thesemiconductor memory device according to the fourth embodiment, takenalong line C1-C2.

FIG. 36 is a sectional view of a memory pillar in the memory cell arrayincluded in the semiconductor memory device according to the fourthembodiment.

FIGS. 37-39 are diagrams showing a process of manufacturing thesemiconductor memory device according to the fourth embodiment.

DETAILED DESCRIPTION

In general, according to one embodiment, a semiconductor memory deviceincludes: a first interconnect layer including a first electrode thatextends in a first direction, and a second electrode that extends in asecond direction and is in contact with one end of the first electrode,the second direction intersecting the first direction; a secondinterconnect layer including a third electrode that is providedadjacently to the first electrode in the second direction, isnon-electrically coupled to the first electrode, and extends in thefirst direction, and a fourth electrode that extends in the seconddirection and is in contact with one end of the third electrode; a firstsemiconductor layer provided between the first electrode and the thirdelectrode and extending in a third direction intersecting the first andsecond directions; a first charge storage layer provided between thefirst semiconductor layer and the first electrode; a second chargestorage layer provided between the first semiconductor layer and thethird electrode; and a first bit line provided above the firstsemiconductor layer, extending in the first direction, and electricallycoupled to the first semiconductor layer.

1. First Embodiment

A semiconductor memory device according to a first embodiment will bedescribed. Hereinafter, a three-dimensionally stacked type NAND flashmemory in which memory cell transistors are three-dimensionally stackedabove a semiconductor substrate will be described as an example of thesemiconductor memory device.

1.1 Configuration 1.1.1 Overall Configuration of Semiconductor MemoryDevice

First, an overall configuration of the semiconductor memory device willbe explained with reference to FIG. 1. FIG. 1 is a block diagram showinga configuration of the semiconductor memory device. In FIG. 1, some ofthe couplings between the blocks are indicated by arrows; however, thecouplings between the blocks are not limited to those shown in FIG. 1.

As shown in FIG. 1, the semiconductor memory device 1 includes a memorycore part 10 and peripheral circuitry 20.

The memory core part 10 includes a memory cell array 11, a row decoder12, and a sense amplifier 13.

The memory cell array 11 includes a plurality of blocks BLK. In theexample shown in FIG. 1, three blocks BLK0 through BLK2 are shown;however, the number of the blocks is not limited to three. The blocksBLK are associated with interconnects extending in a row direction and acolumn direction, and include a plurality of three-dimensionallyarranged memory cell transistors.

The row decoder 12 decodes a row address received from an externalcontroller (not shown). The row decoder 12 selects a row direction ofthe memory cell array 11 based on a result of the decoding. Morespecifically, the row decoder 12 applies voltages to the interconnectsfor selecting a row direction.

The sense amplifier 13 senses data from any of the blocks BLK when adata read is performed. When a data write is performed, the senseamplifier 13 applies a voltage to the memory cell array 11 in accordancewith write data.

The peripheral circuitry 20 includes a sequencer 21 and a voltagegenerator 22.

The sequencer 21 controls the operation of the entire semiconductormemory device 1. More specifically, the sequencer 21 controls a voltagegenerator 22, a row decoder 12, and a sense amplifier 13, etc., when awrite operation, a read operation, or an erase operation is performedbased on instructions from an external controller.

The voltage generator 22 generates voltages necessary for a writeoperation, a read operation, and an erase operation, and supplies thevoltages to the row decoder 12 and the sense amplifier 13, etc.

1.1.2 Circuitry Configuration of Memory Cell Array

Next, the circuitry configuration of the memory cell array 11 will bedescribed with reference to FIG. 2. FIG. 2 is a circuit diagram of thememory cell array 11 in one block BLK. As shown in FIG. 2, a block BLKincludes a plurality of string units SU (SU0, SU1 . . . ). Each stringunit SU includes a plurality of memory groups MG. Each memory group MGincludes two memory strings MSa and MSb coupled to each other inparallel. Hereinafter, memory strings MSa and MSb will be referred to asmemory string MS, unless specified.

Memory string MSa includes eight memory cell transistors MCa0 to MCa7and select transistors STa1 and STa2, for example. Similarly, memorystring MSb includes eight memory cell transistors MCb0 to MCb7 andselect transistors STb1 and STb2. Hereinafter, memory cell transistorsMCa0 to MCa7 and MCb0 to MCb7 will be referred to as memory celltransistors MC, unless specified. Select transistors STa1 and STb1 willbe referred to as select transistors ST1, and select transistors STa2and STb2 are referred to as select transistors ST2, unless specified.

Each memory cell transistor MC includes a control gate and a chargestorage layer, and stores data in a non-volatile manner. Each memorycell transistor MC may be of a MONOS type that uses an insulating layeras the charge storage layer, or may be of an FG type that uses aconductive layer as the charge storage layer. In the present embodiment,a MONOS type memory cell transistor will be described as an example. Thenumber of memory cell transistors MC included in each memory string MSmay be 16, 32, 48, 64, 96, 128, etc., and the number is not limited tothese numbers. Furthermore, the number of select transistors ST1 and ST2included in each memory string MS can be determined as appropriate, aslong as one select transistor ST1 and one select transistor ST2 areincluded.

The memory cell transistors MC and the select transistors ST1 and ST2included in each memory string MS are coupled in series. Morespecifically, in memory string MSa, the current paths of selecttransistor STa2, memory cell transistors MCa0 through MCa7, and selecttransistor STa1 are coupled in series in order. Similarly, in memorystring MSb, the current paths of select transistor STb2, memory celltransistors MCb0 through MCb7, and select transistor STb1 are coupled inseries in order. The drains of select transistor STa1 and selecttransistor STb1 included in one memory group MG are coupled in common toany of a plurality of bit lines BL (BL0, . . . , BL(N−1), herein (N−1)is an integer equal to or greater than 2). The plurality of bit lines BLare independently controlled by the sense amplifier 13. The sources ofselect transistor STa2 and select transistor STb2 included in one memorygroup MG are coupled in common to source line SL.

In the string unit SU, the gates of the plurality of select transistorsSTa1 are coupled in common to select gate line SGDa, and the gates ofthe plurality of select transistors STb1 are coupled in common to selectgate line SGDb. More specifically, in string unit SU0, the gates of theplurality of select transistors STa1 are coupled in common to selectgate line SGDa0, and the gates of the plurality of select transistorsSTb1 are coupled in common to select gate line SGDb0. Similarly, instring unit SU1, the gates of the plurality of select transistors STa1are coupled in common to select gate line SGDa1, and the gates of theplurality of select transistors STb1 are coupled in common to selectgate line SGDb1. Hereinafter, select gate lines SGDa and SGDb will bereferred to as select gate lines SGD, unless specified. Each select gateline SGD is independently controlled by the row decoder 12.

In each block BLK, the gates of a plurality of the select transistorsSTa2 are coupled in common to select gate line SGSa, and the gates of aplurality of the select transistors STb2 are coupled in common to selectgate line SGSb. Select gate lines SGSa and SGSb may be coupled in commonto the row decoder 12, for example, and may be independently controlledby the row decoder 12. Hereinafter, select gate lines SGSa and SGSb willbe referred to as select gate lines SGS, unless specified.

In each block BLK, the control gates of a plurality of memory celltransistors MCa0 through MCa7 and MCb0 through MCb7 are respectivelycoupled in common to word lines WLa0 through WLa7 and WLb0 through WLb7provided in each block BLK. Word lines WLa0 through WLa7 and WLb0through WLb7 are independently controlled by the row decoder 12.Hereinafter, word lines WLa and WLb will be referred to as word linesWL, unless specified.

A block BLK is a unit of data erasure, for example, and data stored inmemory cell transistors MC included in a block BLK is erased in a batch.Each of a write operation and a read operation is performed to theentire memory cell transistors MC coupled to one word line WL of onestring unit SU in common.

In the memory cell array 11, the drains of select transistors STa1 andSTb1 in a plurality of memory groups MG arranged in the same row arecoupled to one bit line BL in common. In other words, the memory groupsMG of respective string units SU are coupled to a bit line BL in common.The string unit SU includes a plurality of memory groups MG coupled todifferent bit lines BL and coupled to the same select gate lines SGD.The block BLK includes a plurality of string units SU sharing the wordlines WL. The memory cell array 11 includes a plurality of blocks BLKsharing the bit lines BL. In the memory cell array 11, the select gatelines SGS, the word lines WL, and the select gate lines SGD are stackedabove the semiconductor substrate; accordingly, the memory celltransistors MC are three-dimensionally stacked.

1.1.3 Planar Configuration of Memory Cell Array

Next, a planar configuration of the memory cell array 11 will bedescribed with reference to FIGS. 3 and 4. FIG. 3 is a plan view showinga part of string unit SU0. FIG. 4 is an enlarged view of region RA shownin FIG. 3. In the example shown in FIG. 3, some of the bit lines BL andintra-layer insulating films are omitted, and in the example shown inFIG. 4, the intra-layer insulating films are omitted.

As shown in FIG. 3, within the cell array, string unit SU0 includes anarea (hereinafter, “plug area”) in which contact CP1 is provided tocontact an interconnect provided above the cell array and aninterconnect provided below the cell array, a cell area, and a steparea. More specifically, the step area, the cell area, and the plug areaare arranged in order, from one end of string unit SU0 to the other end,along the X-axis direction parallel to the semiconductor substrate. Thestep area may be provided on both sides of the string unit SU, and aplurality of the cell areas and the plug areas may be provided along theX-axis direction.

In the memory cell array 11, an interconnect layer 33 that functions asa select gate line SGS, interconnect layers 34-0 through 34-7 thatfunction as word lines WL0 through WL7, and an interconnect layer 35that functions as select gate line SGD are stacked in the Z-axisdirection which is perpendicular to the semiconductor substrate.Furthermore, each of the interconnect layers is divided into two by amemory trench MT filled with an insulating material. More specifically,the interconnect layer 35 for example is divided into two by the memorytrench MT, and functions as select gate lines SGDa0 and SGDb0.Similarly, each of the interconnect layers 34-0 through 34-7 is dividedinto two by the memory trench MT, and functions as word lines WLa0through WLa7 and WLb0 through WLb7. The interconnect layer 33 is dividedinto two by the memory trench MT, and functions as select gate linesSGSa and SGSb.

Each of the interconnect layers 33, 34-0 through 34-7, and 35 includeselectrode HW that extends in the X-axis direction and that is interposedbetween a slit SLT that separates one block from another and the memorytrench MT, and a plurality of electrodes FNG each surrounded by thememory trench MT extending in the Y-axis direction which is parallel tothe semiconductor substrate and perpendicular to the X-axis direction.

The electrodes HW are provided in the sides of the string unit SUextending in the X-axis direction. More specifically, in the exampleshown in FIG. 3, electrode HW of select gate line SGDa0 is provided inone side (shown in the top of the drawing sheet) of string unit SU0extending in the X-axis direction, and electrode HW of select gate lineSGDb0 is provided in the other side (shown in the bottom of the drawingsheet) of string unit SU0 extending in the X-axis direction.

The plurality of electrodes FNG are provided in the cell area. ElectrodeFNG is a plate arranged in parallel to the semiconductor substrate, andone end in the Y-axis direction is coupled to electrode HW, and theother end is isolated from neighboring electrode HW by the memory trenchMT. More specifically, in the X-axis direction, the plurality ofelectrodes FNG corresponding to select gate line SGDa0 and the pluralityof electrodes FNG corresponding to select gate line SGDb0 are isolatedby the memory trench MT and they are alternately coupled to electrodesHW shown in the top and bottom of the drawing sheet. In other words, theelectrodes FNG of select gate line SGDa0 and the electrodes FNG ofselect gate line SGDb0 are alternately arranged in the X-axis direction.The interconnect layers 33 and 34-0 through 34-7, i.e., select gate lineSGS and word lines WL0 through WL7, are also arranged in a similarmanner. Accordingly, the memory trench MT has a shape of a square waveextending in the X-axis direction in the cell area.

In the cell area, a plurality of memory pillars MP respectivelycorresponding to the memory groups MG are formed so as to divide thememory trench MT. The structure of the memory pillars MP will bedescribed later in detail. In the example shown in FIG. 3, the long axisof the oval-shaped memory pillar MP orthogonally intersects the memorytrench MT. The memory pillars MP are separated each other by the memorytrench MT. The memory pillars MP are arranged in eight rows along theY-axis direction. Columns of the eight memory pillars MP intersectingthe memory trench MT are arranged in a staggered manner along the X-axisdirection.

An interconnect layer VL electrically coupled to each memory pillar MPis formed above the memory pillar MP. A plurality of bit lines BLextending in the Y-axis direction are provided above the interconnectlayers VL, and each interconnect layer VL is electrically coupled to oneof the bit lines BL via contact plug CP2. More specifically, eight bitlines BL extending in the Y-axis direction are arranged above eightmemory pillars MP arranged along the Y-axis direction, in other words,eight interconnect layers VL. The eight interconnect layers VL arerespectively coupled to the bit lines BL via contact plug CP2.

In the plug area, a plurality of contact plugs CP1 are formed in aninternal area surrounded by the memory trench MT. The outer side surfaceof contact plug CP1 is covered with an insulating layer 43. Contact plugCP1 passes through the memory cell array 11, and electrically couples aninterconnect (not shown) provided above the memory cell array 11 and acircuit (not shown) provided below the memory cell array 11 (forexample, the row decoder 12 or the sense amplifier 13). Since the plugarea is isolated from the slit SLT by being surrounded by the memorytrench MT, the plug area is not to be metal-replaced. Accordingly, evenif contact plug CP1 is formed in this area, the contact plug CP1 willnot be in electrical contact with the word lines WL and select gatelines SGD and SGS. The number of contact plugs CP1 arranged in theinternal area can be determined as appropriate. The outer area that isnot surrounded by the memory trench MT in the plug area, in other words,the interconnect layers 33, 34-0 through 34-7, and 35 in the sides ofstring unit SU0 extending in the X-axis direction are brought into aconductive state by a replacement process, which will be describedlater, from the slit SLT side, and the areas serve as electrodes HW.

In the step area, the ends of the interconnect layers 33, 34-0 through34-7, and 35 are drawn out in a stepwise manner along the X-axisdirection (hereinafter, each drawn-out end will be called a “terrace”).Each terrace is coupled to its corresponding electrode HW. In otherwords, electrodes HW couple the terraces with electrodes FNG. FIG. 3shows an example in which the terraces corresponding to select gate lineSGSa, word lines WLa0 through WLa7, and select gate line SGDa0 areformed in one end of string unit SU0, and the terraces corresponding toselect gate line SGSb, word lines WLb0 through WLb7, and select gateline SGDb0 are formed in the not-shown other end of string unit SU0. Oneach terrace, contact plug CP3 is formed. In other words, the terracefunctions as a unit to be coupled to contact plug CP3. Contact plug CP3electrically couples each terrace with upper-layer interconnects (notshown). For example, the upper end of contact plug CP3 is coupled to therow decoder 12, which is formed below the memory cell array 11, via theinterconnect layers formed above the memory cell array 11 and contactplug CP1.

Two slits SLT extending in the X-axis direction are provided in such amanner that the slits are respectively in contact with two sides ofstring unit SU0 extending in the X-axis direction. The slits SLT arefilled with an insulating material, and the sides of the slits SLT arein contact with the interconnect layers 33, 34-0 through 34-7, and 35.

Next, the memory pillars MP and the interconnect layer VL will bedescribed in detail. As shown in FIG. 4, the memory trench MT and thememory pillars MP are formed between select gate line SGDa0 and selectgate line SGDb0 extending in the Y-axis direction. On the inner sidesurface of the memory pillar MP, a block insulating film 36, a chargestorage layer 37, a tunnel insulating film 38, and a semiconductor layer39 are formed in order, and the inside of the memory pillar MP is filledwith a core layer 40. The interconnect layer VL electrically coupled tothe semiconductor layer 39 is formed above the memory pillar MP. Contactplug CP2 is formed on the interconnect layer VL, and the interconnectlayer VL is coupled to one bit line BL via the contact plug CP2.

The plurality of memory pillars MP arranged along the Y-axis directionare coupled to bit lines BL, respectively. For this reason, if, forexample, eight memory pillars MP are arranged in the Y-axis direction,at least eight bit lines BL are arranged above the memory pillars MP.Accordingly, a diameter of the memory pillar MP in the X-axis directionis dependent on an interconnect width and an interconnect interval ofthe bit lines BL. In contrast, it is preferable to set a diameter of thememory pillar MP in the Y-axis direction smaller, so that an increase insize of the string unit SU can be suppressed. For this reason, it ispreferable to form the memory pillar MP in an oval shape in which thediameter in the Y-axis direction in which the bit lines BL extend isshorter than the diameter in the X-axis direction. In order to reserve asufficient area for coupling the interconnect layer VL to contact plugCP2 even in the end of the memory pillar MP in the X-axis direction, itis preferable to set the length of the interconnect layer VL in theX-axis direction longer than a diameter of the memory pillar MP in theX-axis direction.

For example, the area including select gate line SGDa0, and a part ofeach of the block insulating film 36 that is in contact with select gateline SGDa0, the charge storage layer 37, the tunnel insulating film 38,and the semiconductor layer 39 of the memory pillar MP function asselect transistor STa1. The area including select gate line SGDb0, and apart of each of the block insulating film 36 that is in contact withselect gate line SGDb0, the charge storage layer 37, the tunnelinsulating film 38, and the semiconductor layer 39 of the memory pillarMP functions as select transistor STb1. The same is true of the wordlines WL and the select gate lines SGS arranged in the lower layers ofselect gate line SGD. The area including word line WLa7 arranged in alower layer of select gate line SGDa0, and a part of each of the blockinsulating film 36 that is in contact with word line WLa7, the chargestorage layer 37, the tunnel insulating film 38, and the semiconductorlayer 39 of the memory pillar MP function as memory cell transistorMCa7, that is, a storage. Similarly, the area including word line WLb7arranged in a lower layer of select gate line SGDb0, and a part of eachof the block insulating film 36 that is in contact with word line WLb7,the charge storage layer 37, the tunnel insulating film 38, and thesemiconductor layer 39 of the memory pillar MP functions as memory celltransistor MCb7. The same is true of the other word lines (WLa0 throughWLa6 and WLb0 through WLb6).

1.1.4 Cross-Sectional Configuration of Memory Cell Array

Next, a cross-sectional configuration of the memory cell array 11 willbe described with reference to FIGS. 5 and 6. FIG. 5 is a sectional viewof the memory cell array 11, taken along line A1-A2 shown in FIG. 3.FIG. 6 is a sectional view of the memory cell array 11, taken along lineB1-B2 shown in FIG. 3. To simplify the description, contact plugs CP2and the bit lines BL are omitted in the examples shown in FIGS. 5 and 6.

As shown in FIG. 5, an insulating layer 31 is formed on thesemiconductor substrate 30. For the insulating layer 31, a silicon oxidefilm (SiO₂) is used, for example. In the insulating layer 31,transistors (not shown) and a plurality of interconnect layers (notshown) formed on the semiconductor substrate 30 are included. Theinterconnect layer 41 is an uppermost interconnect layer among theplurality of interconnect layers. The memory cell array 11 is formed onthe insulating layer 31. More specifically, in the example of FIG. 5,the interconnect layer 32 that functions as a source line is formed onthe insulating layer 31 in the cell area and the step area. Theinterconnect layer 32 is made of a conductive material, and as theconductive material, a metallic material, such as tungsten (W) ortitanium nitride (TiN), or a semiconductor, such as Si, may be used. Onthe interconnect layer 32, the interconnect layer 33 that functions asselect gate line SGS, the interconnect layers 34-0 through 34-7 thatfunction as word lines WL0 through WL7, and the interconnect layer 35that functions as select gate line SGD are stacked, with the insulatinglayer 31 being interposed therebetween. In other words, the interconnectlayers 33, 34-0 through 34-7, and 35 are arranged with a spacetherebetween in the Z-axis direction. The interconnect layers 33, 34-0through 34-7, and 35 are made of a conductive material, and a metallicmaterial, such as tungsten (W) and titanium nitride (TiN), or asemiconductor, such as Si, may be used as the conductive material.Hereinafter, an example where W and TiN are used for the interconnectlayers 33, 34-0 through 34-7, and 35 will be explained in the presentembodiment. TiN functions as a barrier layer or an adhesion layer when Wis formed.

In the cell area, the memory pillars MP that pass through theinterconnect layers 33, 34-0 through 34-7, and 35 and are in contactwith the interconnect layer 32 at their bottom surfaces, and the memorytrench MT are alternately formed along the X-axis direction. The memorypillar MP is formed inside a hole AH. More specifically, in the cellarea, in order to form the memory pillars MP, the holes AH that passthrough the interconnect layers 33, 34-0 through 34-7, and 35 and have abottom surface being in contact with the interconnect layer 32 areformed in the cell area. In the inner side surface of each hole AH, theblock insulating film 36, the charge storage layer 37, and the tunnelinsulating film 38 are laminated in order. In the hole AM, asemiconductor layer 39, which is in contact with the tunnel insulatingfilm 38 at its side surface and in contact with the interconnect layer32 at its bottom surface, is formed, and the inside of the semiconductorlayer 39 is filled with the core layer 40. On the semiconductor layer 39and the core layer 40, a semiconductor layer 39B is formed as a caplayer. For the block insulating film 36, the tunnel insulating film 38,and the core layer 40, SiO₂ is used, for example. For the charge storagelayer 37, a silicon nitride film (SiN) is used, for example. For thesemiconductor layers 39 and 39B, polycrystalline (poly-Si) is used, forexample.

On each memory pillar MP, contact plug CP4 electrically coupled to thesemiconductor layer 39B is formed, and an interconnect layer VL isformed on contact plug CP4. Contact plug CP4 and the interconnect layerVL are made of a conductive material. In the present embodimenthereinafter, a case where contact plug CP4 and the interconnect layer VLare integrally made of titanium (Ti), TiN, and W. For example, Ti isused to form a silicide layer in the interface with the semiconductorlayer 39B and to reduce a resistance value in the interface with thesemiconductor layer 39B.

The memory trench MT extends in the Y-axis direction, and the insidethereof is filled with SiO₂, for example.

In the plug area, ten sacrificial layers 50 used to form theinterconnect layers 33, 34-0 through 34-7, 35, and 42 are stacked with aspace interposed therebetween in the Z-axis direction. Furthermore, inthe plug area, contact plug CP1 that passes through the ten sacrificiallayers 50 is formed. The bottom surface of contact plug CP1 is incontact with the interconnect layer 41 formed in a lower layer of theinterconnect layer 32, and the outer side surface of contact plug CP1 iscovered with the insulating layer 43. For the insulating layer 43, SiO₂is used, for example. For the sacrificial layers 50, SiN is used, forexample. The SiN used for the sacrificial layers 50 in the plug area isnot etched even during the replacement process, which will be describedlater.

The sacrificial layers 50 in the plug area may be however replaced. Inthis case, the insulating layer 43 prevents contact plug CP1 from beingelectrically coupled to the replaced interconnect layer.

The interconnect layer 41 is coupled to a not-shown circuit, e.g., therow decoder 12 or the sense amplifier 13, etc. As described above, theinterconnect layer 41 is located below the memory cell array 11, and isan interconnect layer of a peripheral circuit (not shown) formed on thesemiconductor substrate 30. The height position of the bottom surface ofcontact plug CP1 is lower than that of the bottom surface of theinterconnect layers 32, and the height position of the top surface ofcontact plug CP1 is higher than the top surface of the interconnectlayer 35. Contact plug CP1 is made of a conductive material, and ametallic material, such as W, Ti, or TiN, or a semiconductor, such asSi, may be used as the conductive material. On contact plug CP1, contactplug V0 is formed so as to couple contact plug CP1 to a not-showninterconnect in an upper layer. Contact plug V0 is made of a conductivematerial. Hereinafter, in the present embodiment, an example where Ti,TiN, and W are used as contact plug V0 will be explained.

In the step area, the terraces are formed by drawing out theinterconnect layers 33, 34-0 through 34-7, and 35 in a stepwise mannerin the X-axis direction. On each terrace, contact plug CP3 is formed.Contact plug CP3 is made of a conductive material. In the following, inthe present embodiment, an example in which W and TiN are used ascontact plug CP3 will be explained.

As shown in FIG. 6, in the cell area, the memory trench extending MT inthe Y-axis direction is divided by the memory pillars MP. In the exampleshown in FIG. 6, the interconnect layers 33, 34-0 through 34-7, and 35arranged on the left side of the drawing sheet with respect to thememory trench MT function as select gate line SGSa, word lines WLa0through WLa7, select gate line SGDa0, respectively. Similarly, theinterconnect layers 33, 34-0 through 34-7, and 35 arranged on the rightside of the drawing sheet with respect to the memory trench MT functionas select gate line SGSb, word lines WLb0 through WLb7, select gate lineSGDb0, respectively.

Slits SLT extending in the X-axis direction are formed in the sides ofthe string unit SU in the Y-axis direction. The bottom surface of theslit SLT reaches the upper surface of the interconnect layer 32. Theside surfaces of the interconnect layers 33, 34-0 through 34-7, and 35are respectively in contact with the side surface of the slit SLT. Theinside of the slit SLT is filled with SiO₂, for example.

1.2 Method of Forming Memory Cell Array

Next, a method of forming the memory cell array 11 will be explainedwith reference to FIGS. 7-15. Each of FIGS. 7-15 shows the plane ofstring unit SU0 explained with reference to FIGS. 3, 5, and 6, the crosssection taken along line A1-A2 (hereinafter, the A1-A2 cross section),and the cross section taken along line B1-B2 (hereinafter, the B1-B2cross section).

In the following description of the present embodiment, a method offorming the interconnect layers 33, 34-0 through 34-7, and 35 by fillinggaps, which are formed by removing the sacrificial layers 50, with aconductive material (hereinafter, “replacement”), will be explained. Inthe following example, SiN is used for the sacrificial layers 50, and amulti-layered film made of W or TiN is used as a conductive material.The material of the sacrificial layers 50 is not limited to SiN. Forexample, the sacrificial layers 50 may be made of a silicon oxynitride(SiON) film, or any material, as long as the material can obtain asufficient selection ratio in wet etching between the material and theinsulating layer 31 which is made of, for example, SiO₂. Furthermore, aplurality of dummy pillars HR (not shown) may be arranged in the steparea. The dummy pillars HR are in an electrically non-conductive state,and they are formed as supports for protecting the gaps formed byremoving the sacrificial layers 50.

As shown in FIG. 7, the interconnect layer 41 is formed above thesemiconductor substrate 30, with the insulating layer 31 beinginterposed therebetween. After forming the insulating layer 31 above theinterconnect layer 41, the interconnect layer 32 is formed. Next, tensacrificial layers 50 corresponding to the interconnect layers 33, 34-0through 34-7, and 35 are formed above the interconnect layer 32, withthe insulating layer 31 being interposed therebetween. At this time, theten sacrificial layers 50 are made in a stepwise manner in the steparea. Then, the insulating layer 31 is further formed above theuppermost sacrificial layer 50, and the surface is polished by, forexample, chemical mechanical polishing (CMP).

As shown in FIG. 8, after forming the memory trench MT that reaches theinterconnect layer 32 with its bottom surface, the inside of the memorytrench MT is filled with SiO₂.

As shown in FIG. 9, the memory pillars MP are formed. More specifically,holes AH that reach the interconnect layer 32 with their bottom surfacesare first made. Next, the block insulating film 36, the charge storagelayer 37, and the tunnel insulating film 38 are laminated in order.Next, the block insulating film 36, the charge storage layer 37, and thetunnel insulating film 38 on the bottom surface of each hole AH and onthe insulating layer 31 (in other words, on the top surface of theinsulating layer 31) are removed by dry etching, thereby forming alamination structure consisting of the block insulating film 36, thecharge storage layer 37, and the tunnel insulating film 38 on the innerside surface of the hole AH. Next, the semiconductor layer 39 and thecore layer 40 are laminated in order, thereby temporarily filling in thehole AH. Next, the core layer 40 on the top surface and a part of thecore layer 40 in the hole AH are removed. Herein, a dimple is formed inthe hole AH. Next, the dimple is filled with the semiconductor layer39B, and excess semiconductor layer 39B on the surface is removed onceagain, thereby forming a cap made of the semiconductor layer 39B only onthe core layer 40. A cap may be not necessarily formed. The method offorming the memory trench MT and the holes AH is not limited to theabove-described methods; for example, the memory trench MT may be formedby first forming the holes AH and then forming the memory trench MT insuch a manner that the memory trench MT divides the holes AH. As shownin FIG. 10, contact plug CP1 is formed. More specifically, after forminga hole corresponding to contact plug CP1 by dry etching, a SiO₂ film isformed by atomic layer deposition (ALD), and the hole is filled up bystacking TiN and W alternately by chemical vapor deposition (CVD) afterSiO₂ in the bottom of the hole AH is removed by reactive ion etching(RIE). Next, TiN and W on the insulating layer 31 are removed.

As shown in FIG. 11, after forming the insulating layer 31 and coveringthe memory pillars MP, the memory trench MT, and the upper surface ofcontact plug CP1, the slits SLT that reach the interconnect layer 32with their bottoms are formed. At this time, the sides of eachsacrificial layer 50 are exposed to the slits SLT.

As shown in FIG. 12, after performing the replacement and forming theinterconnect layers 33, 34-0 through 34-7, and 35, the slits SLT arefilled with SiO₂. More specifically, wet etching using, for example,phosphoric acid (H₃PO₄) is first performed. The sacrificial layers 50(SiN) are thereby etched from the slit SLT, and gaps are formed. Next,TiN and W are formed in order to fill in the gaps. Next, TiN and W onthe side surface of the slit SLT and on the top surface of theinsulating layer 31 are removed, thereby forming the interconnect layers33, 34-0 through 34-7, and 35. Next, the slit SLT is filled with SiO₂.

As shown in FIG. 13, holes corresponding to contact plugs V0, CP4, andCP3 are made. The order of making the holes is not limited to the orderdescribed herein. The holes may be made in a batch, or may beindividually made.

As shown in FIG. 14, a trench pattern corresponding to the interconnectlayer VL is formed.

As shown in FIG. 15, after laminating a barrier layer (e.g., Ti and TiN)and W, the barrier layer and W on the insulating layer 31 are removed,and contact plugs V0, CP4, and CP3, and the interconnect layer VL areformed in a batch.

1.3 Advantageous Effects of First Embodiment

The configuration according to the present embodiment can improve thereliability. Such advantageous effects will be explained in detail.

For example, if each of the interconnect layers 33, 34-0 through 34-7,and 35 are divided into a plurality of interconnect layers extending inthe X-axis direction, in other words, if a plurality of memory trenchesMT extending in the X-axis direction are formed, a width of the memorytrench MT and a distance between memory trenches MT in the plug area aresmaller than those in the cell area, because it is necessary to reservean area where contact plug CP1 is to be formed, and to couple the wordlines WL and select gate lines SGD and SGS between two cell areas with aplug area being interposed therebetween. For this reason, there is ahigh possibility that a pattern of the interconnect layer (sacrificiallayer 50) collapses in the plug area at the time of forming the memorytrench MT. Furthermore, when a plurality of interconnect layersextending in the X-axis layer are formed, a hole-shaped slit SLT isformed on the memory trench MT, and the sacrificial layers 50 are thenreplaced. For this reason, etching of the sacrificial layers 50 isinsufficiently performed, and gaps are not properly filled with TiN andW; as a result, a possibility of failure in forming the interconnectlayers increases. Furthermore, an effective interconnect width of eachinterconnect layer becomes narrower because of the plurality of memorypillars MP arranged along the memory trench MT; as a result, a wiringresistance of the word lines WL and select gate lines SGD and SGS tendsto be higher.

In contrast, in the configuration according to the present embodiment,each of the interconnect layers 33, 34-0 through 34-7, and 35 includesthe electrode HW extending in the X-axis direction and a plurality ofelectrodes FNG extending in the Y-axis direction. Furthermore, theelectrodes FNG of two interconnect layers in the same layer can bealternately arranged in the X-axis direction in the cell area, and theplurality of memory pillars MP can be arranged between the twoelectrodes FNG along the Y-axis direction. Thus, the interconnect layers33, 34-0 through 34-7, and 35 are not divided by the memory trench MT inthe plug area; as a result, it is possible to prevent the interconnectwidth and the distance between the interconnects from becoming smaller,and to reduce the possibility of a pattern collapse.

Furthermore, according to the configuration of the embodiment, the slitsSLT are formed on the sides of the sacrificial layers 50 correspondingto the electrode HW and thereby the replacement can be performed; thus,it is possible to supply a solution (H₃PO₄) for wet etching from aline-shaped area which is of a size generally larger than a hole, and tosuppress failures in forming interconnect layers due to insufficientremoval of the sacrificial layers 50 and insufficient filling of gaps.

Furthermore, according to the configuration of the present embodiment,no memory pillars MP are formed above the electrode HW, and thereby awidth of the electrode HW is ensured; therefore, it is possible tosuppress an increase in wiring resistance.

Furthermore, since an increase in wiring resistance in the interconnectlayers 33, 34-0 through 34-7 and 35 can be suppressed, it is possible tosuppress an increase in a pressurizing period when a voltage is appliedto the interconnect layers 33, 34-0 through 34-7 and 35. Accordingly, itis possible to suppress a decrease in a processing rate of thesemiconductor memory device.

2. Second Embodiment

Next, the second embodiment will be described. In the second embodiment,an example of forming a memory trench MT corresponding to two stringunits SU will be explained. Hereinafter, only matters different from thefirst embodiment will be described.

2.1 Circuit Configuration of Memory Cell Array

First, the circuit configuration of the memory cell array 11 will bedescribed with reference to FIG. 16. FIG. 16 is a circuit diagram of thememory cell array 11 in one block BLK.

As shown in FIG. 16, a memory group MG includes two memory strings, MSaand MSb, and global select transistor GST1. More specifically, theconfiguration of memory strings MSa and MSb is the same as that of thefirst embodiment shown in FIG. 2. The drains of select transistors STa1and STb1 are coupled to the source of global select transistor GST1 incommon. The drain of global select transistor GST1 is coupled to any ofthe bit lines BL.

The gates of a plurality of global select transistors GST1 in a stringunit SU are coupled to global select gate line GSGD in common. Morespecifically, the gates of the plurality of global select transistorsGST1 in string unit SU0 are coupled to global select gate line GSGD0 incommon. Similarly, the gates of the plurality of global selecttransistors GST1 in string unit SU1 are coupled to global select gateline GSGD1 in common. Each global select gate line GSGD is independentlycontrolled by the row decoder 12.

The gates of a plurality of select transistors STa1 in string units SU0and SU1 are coupled to select gate line SGDa0. Similarly, the gates ofthe plurality of select transistors STb1 in string units SU0 and SU1 arecoupled to select gate line SGDb0.

Accordingly, when the memory string MSa in string unit SU0 is selected,a high-level voltage is applied to global select gate line GSGD0 andselect gate line SGDa0. As a result, global select transistors GST1 andselect transistors STa1 of string unit SU0 are turned into an on state.When memory string MSb of string unit SU0 is selected, a high-levelvoltage is applied to global select gate line GSGD0 and select gate lineSGDb0. As a result, global select transistors GST1 and selecttransistors STb1 of string unit SU0 are turned into an on state.Similarly, when memory string MSa of string unit SU1 is selected, ahigh-level voltage is applied to global select gate line GSGD1 andselect gate line SGDa0, and if memory string MSb of string unit SU1 isselected, a high-level voltage is applied to global select gate lineGSGD1 and select gate line SGDb0.

2.2 Planar Configuration of Memory Cell Array

Next, the planar configuration of the memory cell array 11 will bedescribed with reference to FIG. 17. FIG. 17 is a plan view partiallyshowing string units SU0 and SU1. In the example shown in FIG. 17, someof the bit lines BL and the intra-layer insulating films are omitted.

As shown in FIG. 17, in the present embodiment, string units SU0 and SU1share the word lines WL and select gate lines SGD and SGS, and onememory trench MT is provided for string units SU0 and SU1. The memorytrench MT divides the interconnect layer 33 that functions as selectgate line SGS, the interconnect layers 34-0 through 34-7 that functionas word lines WL0 through WL7, and the interconnect layer 35 thatfunctions as select gate line SGD, into two parts. Each of theinterconnect layers 33, 34-0 through 34-7, and 35 includes electrode HWand a plurality of electrodes FNG, similarly to the first embodiment.Furthermore, the memory trench MT has a shape of a square wave so as todivide the plurality of electrodes FNG.

An interconnect layer 42 that functions as global select gate line GSGDis formed above the interconnect layer 35. The interconnect layer 42 isdivided into two by the slit GST and the slit SLT extending in theX-axis direction, and the divided layer functions as global select gatelines GSGD0 and GSGD1.

In the cell area, the memory pillars MP that pass through theinterconnect layers 33, 34-0 through 34-7, 35, and 42 are formed betweenelectrodes FNG extending in the Y-axis direction. More specifically,eight memory pillars MP corresponding to string unit SU0 and eightmemory pillars MP corresponding to string unit SU1 are arranged in theY-axis direction, and groups of the eight memory pillars are arranged ina staggered manner along the X-axis direction.

In the present embodiment, the interconnect layers 33, 34-0 through34-7, 35, and 42 are formed throughout the plug area. The outer sidesurface of contact plug CP1 is covered with an insulating layer 43, sothat the interconnect layers 33, 34-0 through 34-7, 35, and 42 are notin contact with contact plug CP1.

In the step area, terraces respectively corresponding to global selectgate lines GSGD, the word lines WL, and select gate lines SGD and SGSare arranged.

In string units SU0 and SU1, the slits SLT are provided in the sidesthat extend in the X-axis direction and that do not contact the slitGST.

2.3 Cross-Sectional Configuration of Memory Cell Array

Next, a cross-sectional configuration of the memory cell array 11 willbe described with reference to FIGS. 18 and 19. FIG. 18 is a sectionalview of the memory cell array 11, taken along line A1-A2 shown in FIG.17. FIG. 19 is a sectional view of the memory cell array 11, taken alongline B1-B2 shown in FIG. 17. To simplify the description, contact plugsCP2 and the bit lines BL are omitted in the examples shown in FIGS. 18and 19.

As shown in FIG. 18, an interconnect layer 42 is formed on the memorytrench MT. The interconnect layer 42 is made of a conductive material,and as the conductive material, a metallic material, such as W or TiN,or a semiconductor, such as Si, may be used. Hereinafter, an examplewhere W and TiN are used for the interconnect layer 42, similar to theinterconnect layers 33, 34-0 through 34-7, and 35, will be explained.The interconnect layer 42 is formed as a result of, for example, areplacement process, similar to the interconnect layers 33, 34-0 through34-7, and 35.

In the cell area, the memory pillars MP that pass through theinterconnect layers 33, 34-0 through 34-7, 35, and 42, and that are incontact with the interconnect layer 32 at their bottom surfaces, areformed.

In the plug area, contact plug CP1 that passes through the interconnectlayers 33, 34-0 through 34-7, 35, and 42 and reaches the interconnectlayer 41 with its bottom surface is formed, and the outer side surfaceof contact plug CP1 is covered with the insulating layer 43. For theinsulating layer 43, SiO₂ is used, for example. Similar to the firstembodiment, the interconnect layer 41 is an interconnect layer of anexternal circuit including the transistors formed above thesemiconductor substrate 30.

In the step area, the terraces are formed by drawing out theinterconnect layers 33, 34-0 through 34-7, 35, and 42 in a stepwisemanner in the X-axis direction. On each terrace, contact plug CP3 isformed.

As shown in FIG. 19, the interconnect layer 42 is divided by the slitGST. In the example shown in FIG. 19, the interconnect layer 42 arrangedon the left side of the slit GST as shown in the drawing functions asglobal select gate line GSGD0. On the other hand, the interconnect layer42 arranged on the right side of the slit GST as shown in the drawingfunctions as global select gate line GSGD1.

The slits SLT extending in the X-axis direction are formed in the leftside of string unit SU0 shown in the drawing, and in the right side ofstring unit SU1 shown in the drawing. The side surfaces of the slits SLTare in contact with the interconnect layers 33, 34-0 through 34-7, 35,and 42.

2.4 Method of Forming Memory Cell Array

Next, a method of forming the memory cell array 11 will be explainedwith reference to FIGS. 20-25. Each of FIGS. 20 to 25 shows the plane ofstring units SU0 and SU1, the A1-A2 cross section, and the B1-B2 crosssection explained with reference to FIGS. 17 to 19.

Hereinafter, an example where the interconnect layers 33, 34-0 through34-7, 35, and 42 are formed by the replacement process will be explainedin the present embodiment.

As shown in FIG. 20, similarly to FIGS. 7 and 8 showing the firstembodiment, a memory trench MT is formed after forming ten sacrificiallayers 50 respectively corresponding to the interconnect layers 33, 34-0through 34-7, and 35.

As shown in FIG. 21, an insulating layer 31 is formed after thesacrificial layer 50 corresponding to the interconnect layer 42 isformed. At this time, the 11 layers of the sacrificial layers 50 aredrawn out in a stepwise manner in the step area.

As shown in FIG. 22, the memory pillars MP and contact plug CP1 areformed. More specifically, the memory pillars MP are first formed asexplained in the first embodiment with reference to FIG. 9. Next, a holecorresponding to contact plug CP1 is made, and an insulating layer 43 isformed on the inner side surface of the hole. Then, the inside of thehole is filled with TiN and W, thereby forming contact plug CP1.

As shown in FIG. 23, after forming the insulating layer 31 and coveringthe upper surface of the memory pillars MP and contact plugs CP1, theslits SLT reaching the interconnect layer 32 with their bottoms areformed. Next, the replacement process is performed to form theinterconnect layers 33, 34-0 through 34-7, 35, and 42. Next, the slitsSLT are filled with SiO₂, for example.

As shown in FIG. 24, after a slit GST is formed to divide theinterconnect layer 42, the inside of the slit GST is filled with SiO₂,for example.

As shown in FIG. 25, contact plugs V0, CP4, and CP3, and theinterconnect layer VL are formed in a batch, as explained in the firstembodiment with reference to FIGS. 13 to 15.

2.5 Advantageous Effects of Second Embodiment

The configuration of the present embodiment achieves advantageouseffects similar to those achieved by the first embodiment.

Furthermore, according to the present embodiment, since two slits SLTare formed for a plurality of string units SU, it is possible tosuppress an increase in an area of the slits SLT in the memory cellarray 11. It is thereby possible to inhibit an increase in an area ofthe chip.

In the present embodiment, two string units SU share a select gate lineSGD; however, three or more string units SU may share a select gate lineSGD.

3. Third Embodiment

Next, the third embodiment will be described. In the third embodiment,an example where materials of electrodes HW and electrodes FNG aredifferent from those described in the first embodiment will bedescribed. Hereinafter, only the matters different from the firstembodiment will be described.

3.1 Planar Configuration of Memory Cell Array

First, the planar configuration of the memory cell array 11 will bedescribed with reference to FIG. 26. FIG. 26 is a plan view showing apart of string unit SU0. In the example shown in FIG. 26, the bit linesBL and the intra-layer insulating films are omitted.

As shown in FIG. 26, in the present embodiment, the conductive materialsof electrodes HW and electrodes FNG are different from those describedin the first embodiment. Interconnect layers 53, 54-0 through 54-7 and55 correspond to electrodes HW of the interconnect layers 33, 34-0through 34-7 and 35 described in the first embodiment, and theinterconnect layers 63, 64-0 through 64-7, and 65 correspond toelectrodes FNG and the terraces of the interconnect layers 33, 34-0through 34-7, and 35 described in the first embodiment.

3.2 Cross-Sectional Configuration of Memory Cell Array

Next, a cross-sectional configuration of the memory cell array 11 willbe described with reference to FIGS. 27 and 28. FIG. 27 is a sectionalview of the memory cell array 11, taken along line A1-A2 shown in FIG.26. FIG. 28 is a cross sectional view of the memory cell array 11 takenalong line C1-C2, which is not arranged on the memory trench MTextending in the Y-axis direction shown in FIG. 26. To simplify thedescription, the contact plugs CP2 and the bit lines BL are omitted inthe examples shown in FIGS. 28 and 29.

As shown in FIG. 27, on the interconnect layer 32, an interconnect layer63 that functions as the electrode FNG of select gate line SGS,interconnect layers 64-0 through 64-7 that function as the electrodesFNG of word lines WL0 through WL7, and the interconnect layer 65 thatfunctions as the electrode FNG of select gate line SGD are stacked witha space being interposed therebetween with respect to the Z-axisdirection. The interconnect layers 63, 64-0 through 64-7, and 65 aremade of a conductive material, for example, poly-Si.

Each memory pillars MP in the present embodiment includes an insulatinglayer 52, a block insulating film 36, a charge storage layer 37, atunnel insulating film 38, and semiconductor layers 39 and 39B, and acore layer 40. For the insulating layer 52, aluminum oxide (AlO_(x)) isused, for example. More specifically, in the inner side surface of thehole AH, the insulating layer 52, the block insulating film 36, thecharge storage layer 37, and the tunnel insulating film 38 are laminatedin order. In the hole AH, a semiconductor layer 39, which is in contactwith the tunnel insulating film 38 at its side surface and in contactwith the interconnect layer 32 at its bottom surface, is formed, and theinside of the semiconductor layer 39 is filled with the core layer 40.On the semiconductor layer 39 and the core layer 40, a semiconductorlayer 39B is formed as a cap layer.

In the plug area, contact plug CP1 that passes through the interconnectlayers 63, 64-0 through 64-7, and 65 and reaches the interconnect layer41 with its bottom surface is formed, and the outer side surface of thecontact plug CP1 is covered with the insulating layer 43.

As shown in FIG. 28, an interconnect layer 53 that functions as theelectrode HW of select gate line SGS, interconnect layers 54-0 through54-7 that function as the electrodes HW of word lines WL0 through WL7,and the interconnect layer 55 that functions as the electrode HW ofselect gate line SGD are stacked with a space interposed therebetweenwith respect to the Z-axis direction. The interconnect layers 53, 54-0through 54-7, and 55 are respectively in contact with the side surfacesof the interconnect layers 63, 64-0 through 64-7, and 65. Theinterconnect layers 53, 54-0 through 54-7 and 55 are made of aconductive material, and a laminated film consisting of, for example,Ti, TiN, and W is used.

3.3 Method of Forming Memory Cell Array

Next, a method of forming the memory cell array 11 will be explainedwith reference to FIGS. 29 to 33. Each of FIGS. 29 to 33 shows the planeof string unit SU0 explained with reference to FIGS. 26 to 28, the A1-A2cross section, and the cross section taken along line C1-C2(hereinafter, the C1-C2 cross section).

As shown in FIG. 29, the interconnect layers 63, 64-0 through 64-7, and65 are formed above the interconnect layer 32, with the insulating layer31 being interposed therebetween. At this time, the interconnect layers63, 64-0 through 64-7, and 65 are made in a stepwise manner in the steparea. Then, an insulating layer 31 is further formed on the interconnectlayer 65, and the surface is flattened. Next, the memory trench MT ismade, and the inside of the memory trench MT is filled with, forexample, SiO₂.

As shown in FIG. 30, the memory pillars MP and contact plug CP1 areformed in a manner similar to the first embodiment as described withreference to FIGS. 9 to 11. Next, after forming the insulating layer 31,the slits SLT reaching the interconnect layer 32 with their bottomsurfaces are made. At this time, the side surfaces of the interconnectlayers 63, 64-0 through 64-7, and 65 are exposed to the inside of theslits SLT.

As shown in FIG. 31, the interconnect layers 63, 64-0 through 64-7, and65 are wet-etched from the slits SLT, and gaps GP are formed in areaswhere the electrodes HW are to be formed.

As shown in FIG. 32, the gaps GP are filled with Ti, TiN and W, inorder. Next, Ti, TiN, and W on the side surface of the slit SLT and onthe top surface of the insulating layer 31 are removed, thereby formingthe interconnect layers 53, 54-0 through 54-7, and 55.

As shown in FIG. 33, the slits SLT are filled with SiO₂. Next, contactplug V0, CP4, and CP3, and the interconnect layer VL are formed in amanner similar to the first embodiment as described with reference toFIGS. 13 to 15.

3.4 Advantageous Effects of Third Embodiment

The configuration of the present embodiment achieves advantageouseffects similar to those achieved by the first embodiment.

Furthermore, according to the present embodiment, it is possible tosuppress an increase in wiring resistance if a material having lowresistance is used for the electrodes HW. More specifically, even ifpoly-Si, which has a higher resistance than W, is used for electrodesFNG, for example, as long as a metallic material having low resistance,such as W, is used for electrodes HW, it is possible to suppress anincrease in wiring resistance from the terraces to the memory pillarsMP.

The third embodiments may be combined with the second embodiment.

4. Fourth Embodiment

Next, the fourth embodiment will be described. In the fourth embodiment,an example where air gaps are formed between interconnects in the memorycell array 11 described in the third embodiment will be explained.Hereinafter, only the matters different from the third embodiment willbe described.

4.1 Cross-Sectional Configuration of Memory Cell Array

Next, a cross-sectional configuration of the memory cell array 11 willbe described with reference to FIGS. 34 to 36. FIG. 34 is a sectionalview of the memory cell array 11, taken along line A1-A2 shown in FIG.26. FIG. 35 is a sectional view of the memory cell array 11, taken alongline C1-C2 shown in FIG. 26. FIG. 36 is an enlarged view of the memorypillar MP in the region RB shown in FIG. 35. To simplify thedescription, the contact plugs CP2 and the bit lines BL are omitted inthe examples shown in FIGS. 34 and 35.

As shown in FIGS. 34 and 35, air gaps AG are formed between theinterconnect layers 63, 64-0 through 64-7, and 65 and between theinterconnect layers 53, 54-0 through 54-7, and 55.

In the plug area, ten interconnect layers 63, 64-0 through 64-7, 65, andnine sacrificial layers 73 used to form the air gaps AG are alternatelystacked. The sacrificial layers 73 in the plug area are not etched evenduring the process of forming the air gaps AG, which will be describedlater. However, the sacrificial layers 73 in the plug area may beremoved to form the air gaps AG in the plug area.

Contact plug CP1 that passes through the interconnect layers 63, 64-0through 64-7, and 65 and the nine sacrificial layers 73, and reaches theinterconnect layer 41 with its bottom surface is formed, and the outerside surface of contact plug CP1 is covered with the insulating layer43.

Other than what is described herein, the configuration of the memorycell array according to the fourth embodiment is the same as that of thethird embodiment shown in FIGS. 27 and 28.

As shown in FIG. 36, in the interconnect layers 54-6, 54-7, and 55, theupper and bottom surfaces thereof, and the sides thereof that arerespectively in contact with the interconnect layers 64-6, 64-7, and 65are covered by the barrier layer 70, and the insides thereof are filledwith the conductive layer 71. For example, Ti and TiN are used for thebarrier layer 70, and W is used for the conductive layer 71. Theinterconnect layers 64-6, 64-7, and 65 extend in the Y-axis direction,and are in contact with the insulating layers 52 of the memory pillarMP. Then, an insulating layer 72 is formed so as to cover the memorypillars, the interconnect layers 64-6, 64-7, and 65, and theinterconnect layers 54-6, 54-7 and 55, and the air gaps AG are formed inthe areas surrounded by the insulating layer 72 and the slit SLT. Forthe insulating layer 72, SiO₂ is used, for example.

4.2 Method of Forming Memory Cell Array

Next, a method of forming the memory cell array 11 will be explainedwith reference to FIGS. 37 to 39.

As shown in FIG. 37, after forming the insulating layer 31 on theinterconnect layer 32, ten interconnect layers 63, 64-0 through 64-7,and 65 and nine sacrificial layers 73 are alternately stacked. For thesacrificial layers 73, SiN is used, for example. The interconnect layers63, 64-0 through 64-7, and 65 are made in a stepwise manner in the steparea. Next, after further forming the insulating layer 31 on theinterconnect layer 65, the memory trench MT is made, and the inside ofthe memory trench MT is filled with, for example SiO₂.

As shown in FIG. 38, similarly to FIG. 32 showing the third embodiment,after forming the interconnect layers 53, 54-0 through 54-7, and 55, thesacrificial layers 73 are removed by wet etching, and the air gaps AGare formed.

As shown in FIG. 39, after forming the insulating layers 72, the slitsSLT are filled with SiO₂.

4.3 Advantageous Effects of Fourth Embodiment

The configuration of the present embodiment achieves advantageouseffects similar to those achieved by the first embodiment.

Furthermore, according to the configuration of the present invention, itis possible to form air gaps between select gate line SGS and a wordline WL, between word lines WL, and between a word line WL and a selectgate line SGD. It is thereby possible to reduce a wiring capacitance ofthe word lines WL, and to reduce an RC delay. The performance of thesemiconductor memory device can be thus improved.

Furthermore, according to the present embodiment, it is possible toreduce a leakage current between the word lines WL by forming the airgaps, thereby improving breakdown voltage. The reliability of thesemiconductor memory device can be thus improved.

Furthermore, according to the present embodiment, it is possible toreduce a wiring capacitance of the word lines WL, and to reduce aninterval of the word lines WL in the Z-axis direction. The semiconductormemory device can be thereby highly integrated.

The first and second embodiments may be combined with the fourthembodiment. In other words, the air gaps may be formed in the first andsecond embodiments.

5. Modifications, Etc

The semiconductor memory device according to the above embodimentsincludes: a semiconductor substrate (30); a first interconnect layer(WLa7) provided above the semiconductor substrate and including a firstelectrode (FNG) that extends in a first direction (Y-axis direction)parallel to the semiconductor substrate, and a second electrode (HW)that extends in a second direction (X-axis direction) and is in contactwith one end of the first electrode, the second direction intersectingthe first direction and being parallel to the semiconductor substrate; asecond interconnect layer (WLb7) including a third electrode (FNG) thatis provided adjacently to the first electrode in the second direction,is non-electrically coupled to the first electrode, and extends in thefirst direction, and a fourth electrode (HW) that extends in the seconddirection and is in contact with one end of the third electrode; a firstsemiconductor layer (39) provided between the first electrode and thethird electrode and extending in a third direction (Z-axis direction)perpendicular to the semiconductor substrate; a first storage (MCa7)provided between the first semiconductor layer and the first electrode;a second storage (MCb7) provided between the first semiconductor layerand the third electrode; and a first bit line (BL) provided above thefirst semiconductor layer, extending in the first direction, andelectrically coupled to the first semiconductor layer.

By applying the forgoing embodiments, it is possible to provide asemiconductor memory device of improved reliability. The embodiments arenot limited to the above-described aspects, but can be modified invarious ways.

The first to fourth embodiments can be combined as far as possible.

In addition, the term “couple” in the foregoing embodiments includes astate of indirect coupling via, for example, a transistor or aresistance.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel methods and systems describedherein may be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the methods andsystems described herein may be made without departing from the spiritof the inventions. The accompanying claims and their equivalents areintended to cover such forms or modifications as would fall within thescope and spirit of the inventions.

1. A semiconductor memory device comprising: a first interconnect layerincluding a first electrode that extends in a first direction, and asecond electrode that extends in a second direction and is in contactwith one end of the first electrode, the second direction intersectingthe first direction; a second interconnect layer including a thirdelectrode that is provided adjacently to the first electrode in thesecond direction, is non-electrically coupled to the first electrode,and extends in the first direction, and a fourth electrode that extendsin the second direction and is in contact with one end of the thirdelectrode; a first semiconductor layer provided between the firstelectrode and the third electrode and extending in a third directionintersecting the first and second directions; a first charge storagelayer provided between the first semiconductor layer and the firstelectrode; a second charge storage layer provided between the firstsemiconductor layer and the third electrode; and a first bit lineprovided above the first semiconductor layer, extending in the firstdirection, and electrically coupled to the first semiconductor layer. 2.The device according to claim 1, further comprising: a secondsemiconductor layer provided between the first electrode and the thirdelectrode, and extending in the third direction; a third charge storagelayer between the second semiconductor layer and the first electrode; afourth charge storage layer provided between the second semiconductorlayer and the third electrode; and a second bit line provided above thefirst and second semiconductor layers and adjacently to the first bitline, extending in the first direction, and electrically coupled to thesecond semiconductor layer.
 3. The device according to claim 2, whereinthe first interconnect layer further includes a fifth electrode that isprovided adjacently to the third electrode in the second direction,extends in the first direction, and is in contact with the secondelectrode at one end of the fifth electrode, and the second interconnectlayer further includes a sixth electrode that is provided adjacently tothe fifth electrode in the second direction, extends in the firstdirection, and is in contact with the fourth electrode at one end of thesixth electrode.
 4. The device according to claim 3, further comprising:a plurality of third semiconductor layers provided between the thirdelectrode and the fifth electrode, extending in the third direction, andarranged along the first direction; and a plurality of fourthsemiconductor layers provided between the fifth electrode and the sixthelectrode, extending in the third direction, and arranged along thefirst direction.
 5. The device according to claim 1, further comprisinga first insulating layer provided between the first electrode and thefirst charge storage layer; and a second insulating layer providedbetween the first charge storage layer and the first semiconductor. 6.The device according to claim 1, further comprising a third interconnectlayer extending in the first direction and being in contact with abottom surface of the first semiconductor layer at an upper surface ofthe third interconnect layer.
 7. The device according to claim 1,wherein the first semiconductor layer has a cylindrical shape, adiameter of the first semiconductor layer in the first direction beinglonger than a diameter in the second direction.
 8. The device accordingto claim 1, further comprising: a first plug provided on the firstsemiconductor layer; and a third interconnect layer provided on thefirst plug, electrically coupled to the first bit line, and extending inthe first direction.
 9. The device according to claim 8, wherein alength of the third interconnect layer in the first direction is longerthan a length of the first semiconductor layer in the first direction.10. The device according to claim 1, wherein the first interconnectlayer further includes a first coupling section that extends in thefirst direction, is coupled to an end of the second electrode at one endof the first coupling section, and is coupled to a first plug at anupper surface of the first coupling section, the second interconnectlayer further includes a second coupling section that extends in thefirst direction, is coupled to an end of the fourth electrode at one endof the second coupling section, and is coupled to the second plug at anupper surface of the second coupling section.
 11. The device accordingto claim 6, further comprising: a plurality of first insulating layersprovided along the third direction; a first plug that passes through theplurality of first insulating layers and is provided between the secondelectrode and the first electrode in the first direction, an uppersurface of the first plug being located at the same height as the heightof the first semiconductor layer, a bottom surface of the first plugbeing located below the third interconnect layer; and a secondinsulating layer provided on a side surface of the first plug.
 12. Thedevice according to claim 6, further comprising a first plug passingthrough the first electrode, a side surface of the first plug beingcovered with the first insulating layer, an upper surface being locatedat the same height as an upper surface of the first semiconductor layer,a bottom surface of the first plug being located below the thirdinterconnect layer.
 13. The device according to claim 2, furthercomprising: a third interconnect layer provided above the firstinterconnect layer and including a fifth electrode provided above thefirst electrode and a sixth electrode provided above the secondelectrode; a fourth interconnect layer provided above the secondinterconnect layer and including a seventh electrode provided above thethird electrode and a eighth electrode provided above the fourthelectrode; a fifth interconnect layer provided above the third andfourth interconnect layers, extending in the first direction, and passedthrough by the first semiconductor layer; a sixth interconnect layerprovided above the third and fourth interconnect layers, extending inthe first direction, being adjacent to the third interconnect layer inthe first direction, and passed through by the second semiconductorlayer; a first transistor provided between the fifth electrode and thefirst semiconductor layer; a second transistor provided between thefifth electrode and the second semiconductor layer; a third transistorprovided between the sixth electrode and the first semiconductor layer;a fourth transistor provided between the sixth electrode and the secondsemiconductor layer; a fifth transistor provided between the fifthinterconnect layer and the first semiconductor layer; and a sixthtransistor provided between the sixth interconnect layer and the secondsemiconductor layer;
 14. The device according to claim 13, wherein whenthe first charge storage layer is selected, a first voltage at a firstlogic level is applied to the third and fifth interconnect layers, asecond voltage at a second logic level is applied to the fourth andsixth interconnect layers, when the second charge storage layer isselected, the first voltage is applied to the fourth and fifthinterconnect layers, and the second voltage is applied to the third andsixth interconnect layers, when the third charge storage layer isselected, the first voltage is applied to the third and sixthinterconnect layers, and the second voltage is applied to the fourth andfifth interconnect layers, when the fourth charge storage layer isselected, the first voltage is applied to the fourth and sixthinterconnect layers, and the second voltage is applied to the third andfifth interconnect layers.
 15. The device according to claim 14, whereinthe first through sixth transistors are turned to an on state when thefirst voltage is applied, and are turned to an off state when the secondvoltage is applied.
 16. The device according to claim 1, wherein a firstconductive material is used for the first and third electrodes, and asecond conductive material different from the first conductive materialis used for the second and fourth electrodes.
 17. The device accordingto claim 16, wherein the first conductive material includes silicon, andthe second conductive material includes tungsten.
 18. The deviceaccording to claim 1, wherein a plurality of first interconnect layersare stacked in the third direction, and air gaps are provided betweenthe plurality of first interconnect layers.
 19. The device according toclaim 1, further comprising: a substrate provided below the firstinterconnection layer, the substrate extending in the first directionand the second direction.